| Original document(197 pages) Authorized document(194 pages) 中文版 |
An electronic parts packaging method comprising the step of joining an electronic part (1-1) to a circuit forming body (6-1) through a joining material (5) containing resin, wherein with bumps (2) in an electronic parts joining region (6a-1) being in electric contact with electrodes (7) in the circuit forming body, thermo-compression bonding is effected to allow the joining material to harden while controlling the flow of the joining material to the peripheral portion of an electronic parts joining region by means of a joining material flow control member (303) associated with the electronic parts joining region. |
Application Number
申请号 |
01811295 |
Application Date
申请日 |
2001.06.14 |
| Title 名称 |
Electronic parts packaging method and electronic parts package |
Publication Number
公开号 |
1436368 |
Publication Date
公开日 |
2003.08.13 |
| Approval Pub. Date |
2006.10.04 |
Granted Pub. Date |
2006.10.04 |
| International Classification 分类号 |
H01L21/60;H01L21/311 |
Applicant(s) Name
申请人 |
Matsushita Electric Industrial Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Nishikawa Hidenobu;Nishida Kazuto;Shimizu Kazumichi |
| Attorney & Agent 代理人 |
wang huimin |
| More information 更 多 信 息 |
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