| Original document(18 pages) 中文版 |
The invention provides a wiring substrate with small danger when being electrically connected to outside by chance or electrically connected inside the wiring substrate by chance without finish machining, and a manufacturing method for effectively obtaining the wiring substrate. The wiring substrate 1 includes a metal core substrate 2 whose plane is a rectangle and which has a surface 4 and a rear surface 5, and a composite layer BU composed of insulative layers 10, 14, 11, 15 and wiring layers 12, 18, 13, 19 which are formed on the surface 4 and the rear surface 5 of the metal core substrate 2, each side face of the metal core substrate 2 is provided with an extending portion 3. |
Application Number
申请号 |
03104456 |
Application Date
申请日 |
2003.02.14 |
| Title 名称 |
Wiring baseboard and making method |
Publication Number
公开号 |
1438832 |
Publication Date
公开日 |
2003.08.27 |
| Approval Pub. Date |
|
Granted Pub. Date |
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| International Classification 分类号 |
H05K1/00;H05K3/46 |
Applicant(s) Name
申请人 |
Nippon Special Ceramic Industry Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Ito Tatsuya;Kimura Yukihiro |
| Attorney & Agent 代理人 |
du rixin |
| More information 更 多 信 息 |
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