Original document(15 pages) Authorized document(15 pages) 中文版
    The present invention provides a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can suppress precipitating of sliver and/or copper, prevents silver or copper from reduction precipitation and form proper lead-free solder on lands of a circuit board.
Application Number
申请号		 02160416 Application Date
申请日		 2002.12.30
Title 名称 Separated out type soldering tin composition and soldering separating out method
Publication Number
公开号		 1440854 Publication Date
公开日		 2003.09.10
Approval Pub. Date 2007.02.07 Granted Pub. Date 2007.02.07
International Classification 分类号 B23K35/24
Applicant(s) Name
申请人		 Harima Chemical K.K.
Address 地址
Inventor(s) Name 发明人 Ikida Ichiteru;Tanaka Kan;Irie Hisao
Attorney & Agent 代理人 wang jian
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