A technology for the air-tight package of the MEMS device by capillary tube method features that the leading-in and out wires and holes are made on the chip of MEMS device and the chip of cavity, said leading-in and -out wires are used to link the peripheral sealing ring with leading-in and-out holes, and after aligned, the sealing rings and leading-in and-out wires of said two chips can constitute metallized capillary tubes. During the soldering, the fused solder flows in the leading-in and -out holes and is spread the surfaces of leading-in and -out wire and sealing ring and then becomes the bridge between two sealing rings. After the solder is solidified, two chips are adhered together to form an air-tight cavity. |