| Original document(16 pages) Authorized document(15 pages) 中文版 |
An isothermal solidifying method for the air-tight package of micro electromechanical sensor (MEMS) features that a solder ring is formed at periphery of cavity and MEMS device. The said solder may be the high-smelting-point and low-smelting-point metals for the cavity or the high-smelting-point metal for MEMS device, and under the sholder ther eis a metal layer composed of adhesive layer and barrier layer. After the cover plate and lower substrate are closed and heated, the low-smelting-point metal is fully molten to complete bonding. Its advantages are high working temp. and wafer-class package. |
Application Number
申请号 |
03129302 |
Application Date
申请日 |
2003.06.13 |
| Title 名称 |
Isothermal solidification method for air-tight packing micro mechanical sensor |
Publication Number
公开号 |
1462868 |
Publication Date
公开日 |
2003.12.24 |
| Approval Pub. Date |
|
Granted Pub. Date |
2005.08.10 |
| International Classification 分类号 |
G01D11/26,H01L21/98 |
Applicant(s) Name
申请人 |
Shanghai Microsystems and Information Technology Research Inst. Chinese Academy |
| Address 地址 |
200050 |
| Inventor(s) Name 发明人 |
Du Maohua, Luo Le |
| Attorney & Agent 代理人 |
pan zhen |
| More information 更 多 信 息 |
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