The invention relates to an oxidation resistant tin copper eutectic non-lead solder. Its alloy weight compositions are that Cu is from 0.4 percent to 1 percent; X is from 0.001 percent from 0.1 percent (the X is Ge and/or P), the surplus quantity are Sn and unavoidable impurity (all above is counted according to the weight percentage). The invention has the key property of the common tin copper eutectic non-lead solder, can apply to all sorts of the non-lead solder product, such as mother alloy, welding rod block, welding wire, mini-type solder ball, welding powder, soldering paste, especially suit to the electronic package technique in the micro electron industry. Compared with the common tin lead solder alloy, the alloy of the invention has no poison element lead; it is added micro alloy element Ge, P based on the tin copper eutectic alloy to improve the oxidation resistant ability of the liquid alloy at high temperature; it can widely apply in electronic industry and general purpose industry. |