| Original document(22 pages) 中文版 |
A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle the gap portion and so as to be substantially parallel to each other. The multilayer PCB also includes at least one ground trace provided between the at least two signal traces and on the top face of the substrate so as to straddle the gap portion. |
Application Number
申请号 |
200510005921 |
Application Date
申请日 |
2005.01.18 |
| Title 名称 |
Multilayer printed circuit board |
Publication Number
公开号 |
1645991 |
Publication Date
公开日 |
2005.07.27 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H05K3/46;H05K1/00 |
Applicant(s) Name
申请人 |
Matsushita Electric Ind Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Takahashi Eiji;Nakayama Takeshi |
| Attorney & Agent 代理人 |
bao yudun |
| More information 更 多 信 息 |
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