This invention relates to a method for processing glass chips under ordinary laboratory conditions including: optimizing sequence of processing bonding of chips to effectively protect glass surface and reduce damage to the chip surface during mechanical punching designing net channels to make them to form holding-on face when gas passes through channels towards the chip edge at bonding to reduce the influence of gas on the main structure, using hydrofluoric vapor to process glass surfaces with water film to make bonding reagent to distribute uniformly. |