Original document(44 pages)  中文版
    Title: Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same
Application Number
申请号		 200610002129 Application Date
申请日		 2006.01.17
Title 名称 Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same
Publication Number
公开号		 1808897 Publication Date
公开日		 2006.07.26
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H03H9/25,H03H9/12,H03H3/08
Applicant(s) Name
申请人		 Seiko Epson Corp.
Address 地址
Inventor(s) Name 发明人 Aoki Shinya, Akahane Kazuhiko
Attorney & Agent 代理人 huang lunwei

  
Thin film sound filter device and method for producing such device
Overcurrent detecting device
Single-phase remote controlled and timed contactless switch controlled with SCM
Methods and systems for robust switching using multi-state switch contacts
Output circuit for semiconductor device, semiconductor device having output circuit, and method of adjusting characteristics of output circuit
AB operation buffer
Novel anti-noise high-speed domino circuit
Methods of reducing power in programmable logic devices using low voltage swing for routing signals
Mobile terminal and method with automatically calibrated clock source
Phase-locked loops and its method, phase frequency detector and its method
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.