Original document(6 pages)  中文版
    A process for preparing the microstructural epoxy resin devices includes transferring amicrostructural pattern from mask to photoresist sheet, silicon or metal by ultraviolet photoetching, silicon reaction ion etching, or electrocasting to obtain a template, mixing PDMS with cross-linking agent, copying the microstructural pattern from template to PDMS sheet by microcopying, mixing the prepolymer of epoxy resin with cross-linking agent, and pouring the mixture onto PDMS mould.
Application Number
申请号		 200510025489 Application Date
申请日		 2005.04.28
Title 名称 Method for making epoxy resin microstructure device
Publication Number
公开号		 1686781 Publication Date
公开日		 2005.10.26
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B81C1/00
Applicant(s) Name
申请人		 Shanghai Jiaotong Univ.
Address 地址 200240
Inventor(s) Name 发明人 Chen Di, Jing Xiangmeng, Li Jianhua, Liu Jingquan
Attorney & Agent 代理人 mao cuiying
More information 更  多  信  息


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