| Original document(13 pages) 中文版 |
A wafer-class packaging technology for the device of micromechanical accelerometer includes such steps as using potassium hydroxide solution to corrode for preparing the protective cavity and non-through holes for leading wires, coating hydrocinnamyl cyclobutene on the front surface of cover plate, where there is said protective cavity, bonding the silicon chip on cover plate with the silicon chip of micromechanical accelerometer, and deep-reaction ion etching to make said non-through holes for leading wires get through. |
Application Number
申请号 |
200510030805 |
Application Date
申请日 |
2005.10.27 |
| Title 名称 |
Disc grade packing tech. for micro mechanical acceleration counter |
Publication Number
公开号 |
1792764 |
Publication Date
公开日 |
2006.06.28 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
B81C1/00,G01P15/00,G01P15/08 |
Applicant(s) Name
申请人 |
Shanghai Inst. of Micro System & Information Tech., CAS |
| Address 地址 |
200050 |
| Inventor(s) Name 发明人 |
Zhang Kun, Li Xinxin, Yang Heng, Wang Yuelin |
| Attorney & Agent 代理人 |
pan zhen |
| More information 更 多 信 息 |
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