Original document(22 pages)  中文版
    Title: Processing method for punched hole of flexible pressing circuit substrate
Application Number
申请号
200510097411 Application Date
申请日
2005.12.28
Title 名称 Processing method for punched hole of flexible pressing circuit substrate
Publication Number
公开号
1802070 Publication Date
公开日
2006.07.12
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H05K3/04,B26F1/02
Applicant(s) Name
申请人
Nippon Matercorone Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Okamoto Hirohiko, Yamaguchi Keisuke, Sasahara Yuichi
Attorney & Agent 代理人 liu jiyang
More information 更  多  信  息


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