| Original document(27 pages) 中文版 |
Disclosed is a process for sealing component assembly to an electrical lighting device using induction healing. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing to damage other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelopes made of borosilicate glass having a CTE form 0 to 300 DEG C. in the range of 30-45x10<-7> DEG C<-1>. |
Application Number
申请号 |
200380105060 |
Application Date
申请日 |
2003.10.21 |
| Title 名称 |
Sealing lighting device component assembly with solder glass preform by using induction heating |
Publication Number
公开号 |
1826678 |
Publication Date
公开日 |
2006.08.30 |
| Approval Pub. Date |
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Granted Pub. Date |
|
| International Classification 分类号 |
H01J9/26,H01J9/32 |
Applicant(s) Name
申请人 |
Corning Inc. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Cooper Timothy J. |
| Attorney & Agent 代理人 |
zhu limeng |
| More information 更 多 信 息 |
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