The present application relates to a thermocompression bonding module (10) including a thermode assembly (12) configured to be mounted to a plate member (16). The thermode assembly (12) includes a heater assembly configured to apply a bonding force to an item during a bonding operation and a control device coupled to the heater assembly for adjusting the bonding force applied by the heater assembly to the item. A force feedback device is positioned, relative to the heater assembly (12) in order to detect the bonding force applied by the heater assembly (12). The control device adjusts the bonding force based on the bonding force detected by the force feedback device. |