| Original document(11 pages) 中文版 |
The invention relates to a tin-zinc base non-lead soft solder with mixed rare earth, wherein it comprises Sn and Xn, and adds Bi, Co, and lanthanide series mixed rare earth on said tin-zinc base; the Zn is at 1.0-12.0%, Bi is 0.5-6%, Co is 0.001-2.0%, lanthanide series mixed rare earth is 0.01-1.2% and left is Sn. The invention can improve the non-lead solder, to obtain electric level, with uniform organism, better welding property and high anti-oxygen property. And it has low fusion point and low cost. |
Application Number
申请号 |
200610037136 |
Application Date
申请日 |
2006.08.16 |
| Title 名称 |
Lead-free solder |
Publication Number
公开号 |
1907634 |
Publication Date
公开日 |
2007.02.07 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
B23K35/26 |
Applicant(s) Name
申请人 |
Dongguan Rerfection Science & Technology Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Bao Dewei;Zhao Wenchuan |
| Attorney & Agent 代理人 |
li weibeng |
| More information 更 多 信 息 |
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