Original document(12 pages)  中文版
    According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
Application Number
申请号		 200610108507 Application Date
申请日		 2006.08.03
Title 名称 Lead-free solder
Publication Number
公开号		 1907635 Publication Date
公开日		 2007.02.07
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B23K35/26;B23K35/02
Applicant(s) Name
申请人		 Fuji Electric Device Technolog
Address 地址
Inventor(s) Name 发明人 Makita Kazuyuki;Ichinose Masaki;Watashima Taketo;Soutome Masayuki;Yamashita Mitsuo;Asagi Takeshi;Hirai Masatoshi;Murata Toru
Attorney & Agent 代理人 long chun
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