Original document(8 pages)  中文版
    The invention relates to an antioxidized solder base non-lead welding solder which can weld in air without welding solder, wherein it is formed by Ag at 0.1-6 deals, Ti at 0.5-6 deals and Y in 0.1-2.5 deals and the Sn. It can avoid any welding solder in air, and it can weld material directly at 24-260Deg. C; the connector shearing strength of said invention is 30-50MPa.
Application Number
申请号		 200610112637 Application Date
申请日		 2006.08.28
Title 名称 Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air
Publication Number
公开号		 1907636 Publication Date
公开日		 2007.02.07
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B23K35/26;B23K1/19
Applicant(s) Name
申请人		 Beijing University of Aeronautics & Astronautics
Address 地址
Inventor(s) Name 发明人 Qu Wenqing;Zhuang Hongshou;Qi Zhigang
Attorney & Agent 代理人 zhou changqi
More information 更  多  信  息


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