Original document(4 pages)  中文版
    The invention relates to an Ag alloy solder used to improve the sealing property of vacuum device, which can reduce the solder cost, wherein based on the AgCu alloy solder, it adds some Ni component, to improve the property of solder, and improve the humidify property and welding strength of mother base of solder, and replace the Pd group solder in multi-stage welding, and reduce the cost.
Application Number
申请号		 200610048627 Application Date
申请日		 2006.08.18
Title 名称 Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering
Publication Number
公开号		 1907639 Publication Date
公开日		 2007.02.07
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B23K35/30;B23K1/19
Applicant(s) Name
申请人		 Sino-Platinum Metals Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Jiang Chuangui;Li Jinghua;Zhang Libin;Kong Jianwen
Attorney & Agent 代理人 sai xiaogang
More information 更  多  信  息


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