| Original document(8 pages) 中文版 |
The invention relates to a method for low-pressure ejecting molding circuit board protective frame, wherein it uses the low-ejection pressure that not hurts the electric element and wires and the low-molding temperature to eject the molding material, and cover it on one circuit board, to form a protective frame that protects the circuit board, the electric elements and wires. |
Application Number
申请号 |
200510088948 |
Application Date
申请日 |
2005.08.03 |
| Title 名称 |
Method of protecting casing of low-voltage ejection shaping circuit |
Publication Number
公开号 |
1907679 |
Publication Date
公开日 |
2007.02.07 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
B29C45/14;B29C45/77;B29C45/78;B29K77/00;B29K67/00 |
Applicant(s) Name
申请人 |
Desong International Co., Ltd. |
| Address 地址 |
|
| Inventor(s) Name 发明人 |
Zhang Boyao |
| Attorney & Agent 代理人 |
zhou guocheng |
| More information 更 多 信 息 |
|
| Related patents information |
|
|
|
|
|
|