Original document(12 pages)  中文版
    The invention discloses a packing material, which comprises the following parts: 100wt% epoxy resin, 30-150% filler, 1-30wt% solidifier and 0.01-20wt% coupler, wherein the coupler is silane coupler.
Application Number
申请号		 200510089171 Application Date
申请日		 2005.08.05
Title 名称 Encapsulating material and method for making same
Publication Number
公开号		 1908108 Publication Date
公开日		 2007.02.07
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C09K3/10;C08L63/00
Applicant(s) Name
申请人		 BYD Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Zhang Yumei
Attorney & Agent 代理人 wang fengdong zhou jianqiu
More information 更  多  信  息


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