| Original document(27 pages) 中文版 |
The present invention relates to an inorganic powder having a frequency-size distribution with multiple peaks, wherein the peaks are present at least in the particle size regions from 0.2 to 2 m and from 2 to 63 m, preferably with the maximum particle size being 63 m or less, the average particle size being from 4 to 30 m, and the mode size being from 2 to 35 m. The inorganic powder of the present invention is useful as a filler for a high thermally conductive member in electronic component-mounted circuit board required to have electrical insulating property and heat radiating performance, in that a heat radiating member comprising the powder can have thermal conductivity, the powder can provide a resin composition having excellent withstand voltage characteristics for forming an insulative composition into a thin film and can be filled in the resin composition at a high density so as to improve heat radiating performance of the resin composition. |
Application Number
申请号 |
200580002157 |
Application Date
申请日 |
2005.01.07 |
| Title 名称 |
Inorganic powder, resin composition filled with the powder and use thereof |
Publication Number
公开号 |
1910122 |
Publication Date
公开日 |
2007.02.07 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
C05F7/02;C08K3/22;H01B3/00;C09K5/08 |
Applicant(s) Name
申请人 |
Showa Denko KK |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Tsuzuki Hiroshi;Kogoi Hisao;Tanaka Jun |
| Attorney & Agent 代理人 |
lin bainan liu jinhui |
| More information 更 多 信 息 |
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