| Original document(24 pages) 中文版 |
A method of manufacturing an electronic device comprising IC elements 10, on a set of opposite faces of which a first electrode 12 and a second electrode 13 are formed, a first circuit layer 20 where an antenna circuit 21 having a slit 1 is formed, and a second circuit layer 30 for electrically connecting the IC elements 10 and the antenna circuit 21. The IC elements 10 are placed individually in cutouts 74, into each of which one IC element 10 can be inserted, the cutouts being formed in the outer circumference of a disk-like carrier 70. Thus, with the method, an electronic device that is inexpensive and is manufactured with high productivity, and has improved communication characteristics is manufactured. |
Application Number
申请号 |
200580002465 |
Application Date
申请日 |
2005.01.07 |
| Title 名称 |
Method of for manufacturing electronic device |
Publication Number
公开号 |
1910595 |
Publication Date
公开日 |
2007.02.07 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
G06K19/00;H01L21/50;H01L21/60 |
Applicant(s) Name
申请人 |
Hitachi Chemical Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Tanaka Kousuke;Ishizaka Hironori;Tasaki Kouji;Shibutani Masahito;Shinzawa Masahisa;Tonotsuka Hidehiko;Iwata Katsuya |
| Attorney & Agent 代理人 |
ge songsheng |
| More information 更 多 信 息 |
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