Original document(18 pages)  中文版
    A film deposition apparatus capable of improving accuracy for forming a fine pattern is provided. The film deposition apparatus comprises a first nozzle (102a) for discharging first chemical species on a base body (160), a second nozzle (102b) for discharging second chemical species on the base body (160), a material storage chamber (101a) for storing the first chemical species and a reaction-active species generation unit 103a for generating reaction-active species, and a material storage chamber (101b) for storing the second chemical species and a reaction-active species generation unit (103b) for generating the reaction-active species. The first nozzle (102a) and the second nozzle (102b) are installed so that the flow of the discharged first chemical species crosses the flow of the second chemical species.
Application Number
申请号
200610110168 Application Date
申请日
2006.08.04
Title 名称 Apparatus and method for forming a film, patterning method and method for manufacturing an optical device
Publication Number
公开号
1912179 Publication Date
公开日
2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 C23C16/448;C23C16/52
Applicant(s) Name
申请人
Seiko Epson Corp.
Address 地址
Inventor(s) Name 发明人 Miyazawa Takashi
Attorney & Agent 代理人 wang huimin
More information 更  多  信  息


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