The invention relates to a copper film covered on electron circuit surface processing method. The principle of this etching method is that using ammonium chloride solution to react with the copper film to generate alkali cupric chloride and cupric chloride ammine complex which reacts with hydrochloric acid to generate alkali cupric chloride precipitation and ammonium chloride. Its advantages are that the etched copper film can be transformed to salable alkali cupric chloride product; the processing ammonium chloride etching solution can be used circularly; thus it has good environmental protection function, and great social and economic benefits. |