Original document(51 pages)  中文版
    When a laser beam is radiated on a semiconductor film under appropriate conditions, the semiconductor film can be crystallized into single crystal-like grains connected in a scanning direction of the laser beam (laser annealing). The invention studies the most efficient laser annealing condition. When a length of one side of a rectangular substrate on which a semiconductor film is formed is b, a scanning speed is V, and acceleration necessary to attain the scanning speed V of the laser beam relative to the substrate is g, and when V=(gb/5.477)<1/2> is satisfied, a time necessary for the laser annealing is made shortest. The acceleration g is made constant, however, when it is a function of time, a time-averaged value thereof can be used in place of the constant.
Application Number
申请号
200610108083 Application Date
申请日
2002.10.30
Title 名称 Laser irradiation method and laser irradiation apparatus, and method for fabricating semiconductor device
Publication Number
公开号
1913105 Publication Date
公开日
2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/20;H01L21/268;H01L21/336
Applicant(s) Name
申请人
Semiconductor Energy Lab
Address 地址
Inventor(s) Name 发明人 Yamazaki Shunpei;Tanaka Koichiro
Attorney & Agent 代理人 gu shan liang yong
More information 更  多  信  息


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