Original document(16 pages)  中文版
    A substrate treating method for treating substrates with a treating solution including sulfuric acid and a hydrogen peroxide solution. The method includes a first preparing step for preparing dilute sulfuric acid of a predetermined concentration by mixing deionized water and sulfuric acid, a second preparing step for preparing the treating solution by mixing the dilute sulfuric acid prepared in the first preparing step and the hydrogen peroxide solution, and a treating step for treating the substrates, in a treating unit that holds the substrates, with the treating solution prepared in the second preparing step.
Application Number
申请号		 200610108747 Application Date
申请日		 2006.08.10
Title 名称 Substrate treating apparatus and method
Publication Number
公开号		 1913108 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/306;H01L21/00
Applicant(s) Name
申请人		 Dainippon Screen Mfg
Address 地址
Inventor(s) Name 发明人 Takahashi Hiroaki
Attorney & Agent 代理人 xu shu
More information 更  多  信  息


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