Original document(25 pages)  中文版
    The invention provides a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.
Application Number
申请号		 200610005941 Application Date
申请日		 2006.01.19
Title 名称 Method and apparatus for flip-chip bonding
Publication Number
公开号		 1913115 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/60
Applicant(s) Name
申请人		 Samsung TECHWIN Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Kim Sang-cheol
Attorney & Agent 代理人 ma gao
More information 更  多  信  息


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