This invention relates to a maintaining method for poor chips in the production of cell phone image modules, in which, the maintaining method includes: a, coating scaling powder: coating a scaling powder uniformly on the poor connection parts of chips, b, firing: firing the chips coated with scaling powder on a warm-up stand under 230-270deg.C, for 2-4 minutes to infiltrate it to the connection place to re-weld the corresponding elements, c, detecting: testing the above mentioned chips according to the requirement and qualified ones become the quality goods. |