| Original document(34 pages) 中文版 |
A method and system for testing a wafer comprising semiconductor chips are disclosed. A determination of whether or not the wafer is defective is made in relation to a spatially related group of filtered failed semiconductor chips on the wafer, where the spatially related group corresponds to a localized failure on the wafer and is used to calculate a defect index value. |
Application Number
申请号 |
200610108737 |
Application Date
申请日 |
2006.08.10 |
| Title 名称 |
Testing method for detecting localized failure on a semiconductor wafer |
Publication Number
公开号 |
1913118 |
Publication Date
公开日 |
2007.02.14 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L21/66;G01R31/00;G01R31/26 |
Applicant(s) Name
申请人 |
Samsung Techwin Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Kang Joong-wuk;Cheong Kwang-yung |
| Attorney & Agent 代理人 |
zhang bei |
| More information 更 多 信 息 |
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