Original document(20 pages)  中文版
    The invention provides an improved integrated circuit, and integrated circuit fabrication method which introduces highly controlled air cavities within high-speed copper interconnects. A polymer material is introduced on the edges of interconnect lines and vias within an interconnect stack. This incorporates and controls air cavities formation, thus enhancing the signal propagation performance of the semiconductor interconnects.
Application Number
申请号		 200610090263 Application Date
申请日		 2006.07.11
Title 名称 Integration control and reliability enhancement of interconnect air cavities
Publication Number
公开号		 1913124 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L21/768;H01L21/764;H01L23/522
Applicant(s) Name
申请人		 ST Microelectronics Crolles 2
Address 地址
Inventor(s) Name 发明人 Torres Joaquin;Gosset Laurent-Georges
Attorney & Agent 代理人 yu mang fang ting
More information 更  多  信  息


 Related patents information
Controlling lateral distribution of air gaps in interconnects
Google
Note:All patent data come from State Intellectual Property Office of the People's Republic of China. If there were discrepancies between here and the State Intellectual Property office, the later is more accurate. The patent data is only for public exchange and learning purposes. We are not responsible for the adverse consequences with unverified use of the data.