Original document(19 pages)  中文版
    This invention relates to a chip package body of asymmetrical molds including a lead frame, a chip, an adhesive layer, multiple lines and a package colloid, in which, the lead frame includes a lead frame body and at least a vortex board, the lead frame body includes multiple internal pin parts, the vortex board bends upwards to form a hunch part and the first end of the board is connected with the frame, the chip is fixed below these pin parts and the vortex board is placed at a side of the chip, the adhesive layer is matched between the chip and these internal pin parts, the lines are connected between the pin parts and the chip, the package colloid wraps the chip, lines, the pin parts, the adhesive layer and the vortex board.
Application Number
申请号		 200510090107 Application Date
申请日		 2005.08.08
Title 名称 Chip package body of asymmetrical moudl
Publication Number
公开号		 1913134 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/31;H01L23/49
Applicant(s) Name
申请人		 Nanmao Science & Technology Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Shen Gengxin
Attorney & Agent 代理人 shou ning zhang huahui
More information 更  多  信  息


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