Original document(15 pages)  中文版
    A plastic leaded chip carrier (PLCC) package includes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package.
Application Number
申请号		 200610112131 Application Date
申请日		 2006.08.11
Title 名称 PLCC package with integrated lens and method for making the package
Publication Number
公开号		 1913135 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/31;H01L21/56
Applicant(s) Name
申请人		 Avago Technologies Ecbu IP
Address 地址
Inventor(s) Name 发明人 Wong Boon S.;Ang Bee K.;Lye Chien C.
Attorney & Agent 代理人 wang yi
More information 更  多  信  息


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