| Original document(13 pages) 中文版 |
A semiconductor device including: a semiconductor chip; a plurality of electrodes formed on the semiconductor chip and arranged along one side of the semiconductor chip; a resin protrusion formed on the semiconductor chip and extending in a direction which intersects the side; and a plurality of electrical connection sections formed on the resin protrusion and electrically connected to the respective electrodes. |
Application Number
申请号 |
200610110141 |
Application Date
申请日 |
2006.08.07 |
| Title 名称 |
Semiconductor device |
Publication Number
公开号 |
1913138 |
Publication Date
公开日 |
2007.02.14 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L23/482 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Hashimoto Nobuaki |
| Attorney & Agent 代理人 |
wang huimin |
| More information 更 多 信 息 |
|
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