| Original document(25 pages) 中文版 |
A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate. |
Application Number
申请号 |
200610110145 |
Application Date
申请日 |
2006.08.07 |
| Title 名称 |
Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device |
Publication Number
公开号 |
1913139 |
Publication Date
公开日 |
2007.02.14 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
H01L23/482;H01L23/488 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
|
| Inventor(s) Name 发明人 |
Hashimoto Nobuaki |
| Attorney & Agent 代理人 |
wang huimin |
| More information 更 多 信 息 |
|
| Related patents information |
Electronic device and producing method thereof
Electronic device and producing method thereof
Electronic device and producing method thereof
Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
Electronic device and its mfg. method
Semiconductor device its mfg. method, electronic device and its mfg. method
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
Coupling structure for component and coupling method
Electronic component, semiconductor device, methods of manufacturing the same
Electronic substrate, semiconductor device, and electronic device
|
|
|