| Original document(16 pages) 中文版 |
In a semiconductor device, a pad metal has at least a portion located immediately under a probe region, and the portion is divided into a plurality of narrow metal layers each arranged in parallel with a traveling direction of a probe. Thus, it is possible to enhance surface flatness of the pad metal and to prevent a characteristic of a semiconductor device from deteriorating without complication in processing and increase in chip size. |
Application Number
申请号 |
200610095646 |
Application Date
申请日 |
2006.06.22 |
| Title 名称 |
Semiconductor device |
Publication Number
公开号 |
1913140 |
Publication Date
公开日 |
2007.02.14 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L23/485 |
Applicant(s) Name
申请人 |
Matsushita Electric Ind Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Nagai Noriyuki;Sakashita Toshihiko |
| Attorney & Agent 代理人 |
shen zhaokun |
| More information 更 多 信 息 |
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