Original document(21 pages)  中文版
    A semiconductor device includes a chip having a base semiconductor layer, an insulation layer provided on the base semiconductor layer, and an upper semiconductor layer provided on the insulation layer; a mounting substrate on which the chip is mounted at the base semiconductor layer; and a connecting portion that electrically couples first terminals provided on the mounting substrate and a surface or second terminals provided thereon of the base semiconductor layer.
Application Number
申请号		 200610115412 Application Date
申请日		 2006.08.08
Title 名称 Semiconductor device
Publication Number
公开号		 1913143 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/488
Applicant(s) Name
申请人		 Fujitsu Media Devices Ltd.
Address 地址
Inventor(s) Name 发明人 Yamaji Takayuki;Ishikawa Hiroshi;Katsuki Takashi;Takahashi Yuji;Nakazawa Fumihiko;Sano Satoshi
Attorney & Agent 代理人 li hui lu dungang
More information 更  多  信  息


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