Original document(16 pages)  中文版
    According to one embodiment, a printed circuit board includes a printed wiring board, a semiconductor package, an adhesive and a stepped portion. The printed wiring board has a plurality of pads. The semiconductor package has a plurality of connection terminals corresponding to the pads and is mounted on the printed wiring board by soldering the connection terminals to the pads. The adhesive is filled between an outer peripheral portion of the semiconductor package and the printed wiring board and fixes the semiconductor package to the printed wiring board. The stepped portion divides an area between the semiconductor package and the printed wiring board into a first region, to which a solder for bonding the connection terminal and the pad is supplied, and a second region in which the adhesive is filled.
Application Number
申请号		 200610103555 Application Date
申请日		 2006.07.21
Title 名称 Printed circuit board and electronic apparatus including printed circuit board
Publication Number
公开号		 1913144 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/498;H05K1/18
Applicant(s) Name
申请人		 Tokyo Shibaura Electric Co.
Address 地址
Inventor(s) Name 发明人 Suzuki Daigo;Hosoda Kuniyasu
Attorney & Agent 代理人 chen yuan zhang tianshu
More information 更  多  信  息


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