| Original document(32 pages) 中文版 |
The present description relates to a drive film, a drive package for an organic light emitting diode display, a method of manufacturing thereof, and an organic light emitting diode display including the same. A drive package for an organic light emitting diode display includes a base film including a central region and a peripheral region, a drive circuit chip mounted on the central region of the base film, a plurality of conductors formed on at least one portion of the peripheral region of the base film, and at least one protective film formed on the conductors and exposing both ends of the conductors in a lengthwise direction. |
Application Number 申请号 |
200610110111 |
Application Date 申请日 |
2006.08.08 |
| Title 名称 |
Driving film, driving package, manufacturing method thereof and display comprising the same |
Publication Number 公开号 |
1913145 |
Publication Date 公开日 |
2007.02.14 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
H01L23/498;H01L25/00;H01L27/32;H01L21/60;G09F9/00;H05B33/12 |
Applicant(s) Name 申请人 |
Samsung Electronics Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Bak Gyong-tae;Goh Chun-seog;Seong See-deok |
| Attorney & Agent 代理人 |
tao fengbei |
| More information 更 多 信 息 |
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