| Original document(38 pages) 中文版 |
A thin film conductor having improved adhesion and superior conductivity, a method for fabricating the same, a thin film transistor (TFT) plate including the thin film conductor, and a method for fabricating the TFT plate are provided. The thin film conductor includes an adhesive layer containing an oxidation-reactive metal or silicidation-reactive metal and silver, a silver conductive layer formed on the adhesive layer, and a protection layer formed on the silver conductive layer and containing an oxidation-reactive metal and silver. |
Application Number
申请号 |
200610112109 |
Application Date
申请日 |
2006.08.11 |
| Title 名称 |
Thin film conductor and method of fabrication |
Publication Number
公开号 |
1913146 |
Publication Date
公开日 |
2007.02.14 |
| Approval Pub. Date |
|
Granted Pub. Date |
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| International Classification 分类号 |
H01L23/532;H01L27/12;H01L21/768;H01L21/84;H01L21/28 |
Applicant(s) Name
申请人 |
Samsung Electronics Co., Ltd. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Cho Beom-seok;Lee Je-hun;Jeong Chang-oh;Bae Yang-ho |
| Attorney & Agent 代理人 |
li wei wu guimeng |
| More information 更 多 信 息 |
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