Original document(26 pages)  中文版
    An electrostatic discharge (ESD) protection structure and a method for forming the same are provided. The structure includes a substrate having a buried layer, and a first and a second high-voltage well region on the buried layer. The first and second high-voltage well regions have opposite conductivity types and physically contact each other. The structure further includes a field region extending from the first high-voltage well region into the second high-voltage well region, a first doped region in the first high-voltage well region and physically contacting the field region, and a second doped region in the second high-voltage well region and physically contacting the field region. The first and second doped regions proceed high doping with impurity of same conductive state of the first high-voltage well region.The inventive product does not degrade by ESD pressure.
Application Number
申请号
200610003144 Application Date
申请日
2006.02.16
Title 名称 ESD protection device and semiconductor chip
Publication Number
公开号
1913148 Publication Date
公开日
2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L23/60;H01L29/73
Applicant(s) Name
申请人
Taiwan Semiconductor Mfg Co.
Address 地址
Inventor(s) Name 发明人 Lee Jian-hsing;Jong Yu-chang
Attorney & Agent 代理人 liu xinyu
More information 更  多  信  息


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