Original document(12 pages)  中文版
    An electronic circuit module and its fabricating method are provided. The electronic circuit module includes a first board and a second board having printed circuit patterns formed on the respective surfaces, and an electronic device disposed between the first board and the second board and having electrodes connected to the first board and the second board through a soldering process.
Application Number
申请号		 200610100997 Application Date
申请日		 2006.08.01
Title 名称 Method for fabricating electronic circuit module and integrated circuit device
Publication Number
公开号		 1913150 Publication Date
公开日		 2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L25/00;H01L25/16;H01L23/488;H01L21/60;H05K1/18;H05K3/34
Applicant(s) Name
申请人		 Samsung Electronics Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Ahn June-hyeon;Lee Young-min;Seo Ho-seong;Kwak Kyu-sub
Attorney & Agent 代理人 rong zhimin
More information 更  多  信  息


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