This invention discloses a multi-chip structure including at least a first chip, a second chip and a first heat conduction layer, in which, the first chip has a first surface and multiple first pads matched on the first surface, the second chip has a second surface and multiple second pads matched on the second surface towards the first surface, the first heat-conductive layer is set between the first and the second chips having a heat conductive region, multiple first connection elements and multiple first dielectric regions, the first connection elements are set in the first heat conductive layer to connect the first surface to the second surface, these first dielectric regions surround these first connection elements isolated with the heat conductive regions by these first dielectric regions. |