Original document(62 pages)  中文版
    Connection structure of storage electrode of trench capacitor at least partly formed on semiconductor substrate and a selection transistor include: intermediate layer part adjacent to storage electrode surface, electrically conducting connection material disposed adjacent to intermediate layer and electrically contacting the exposed portion of the substrate surface adjacent to selection transistor surface. Part of conncetion structure is higher than semiconductor substrate surface disposition, so adjoin to the horizontal substrate surface.
Application Number
申请号
200610109164 Application Date
申请日
2006.08.03
Title 名称 Connection structure and method for manufacturing same
Publication Number
公开号
1913161 Publication Date
公开日
2007.02.14
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H01L27/108;H01L23/522;H01L21/8242;H01L21/768
Applicant(s) Name
申请人
Infineon Technologies AG
Address 地址
Inventor(s) Name 发明人 Heineck Lars;Popp Martin
Attorney & Agent 代理人 wang qianghai liang yong
More information 更  多  信  息


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