This invention relates to an image sensing chip packaging structure and a digital camera module applying it, in which, the image sensing chip packaging structure includes: a loader, an image sensing chip, several leads and a light conduction board, said loader includes a body and conducting channel set in it to form a pad region at the outside of the body, said image sensing chip has a sensing region set in the loader, said several leads are connected with the pad region of the loader and the image sensing chip and wrapped by glue, said penetration board covers the loader to form a space around the sensing region with the glue. |