Original document(13 pages)  中文版
    An in-situ treating method for the polishing liquid used for chemico-mechanical polishing (CMP) of metal features that based on the electrochemical principle, the metallic ions generated by polishing are removed by reducing transfer and the function of oxidant in polishing liquid is restored. Its apparatus features that the in-situ treating system of polishing liquid and the in-line repairing system of polishing disc are additionally used in the traditional polishing system.
Application Number
申请号		 200610030551 Application Date
申请日		 2006.08.30
Title 名称 Method for batch processing polishing fluid in situ for chemico-mechanical polishing metal, and equipment utilized
Publication Number
公开号		 1915595 Publication Date
公开日		 2007.02.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B24B57/00;C25C1/00;B24B53/00
Applicant(s) Name
申请人		 Shanghai Inst of Microsystems and Information, C.A.S
Address 地址
Inventor(s) Name 发明人 Zhang Kailiang;Song Zhitang;Feng Songlin;Chen Bangming
Attorney & Agent 代理人 pan zhen
More information 更  多  信  息


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