Original document(14 pages)  中文版
    The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.
Application Number
申请号		 200610121531 Application Date
申请日		 2006.08.17
Title 名称 Transparent polishing pad
Publication Number
公开号		 1915596 Publication Date
公开日		 2007.02.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B24D17/00;H01L21/304
Applicant(s) Name
申请人		 Rhom And Hass Electronic Mater
Address 地址
Inventor(s) Name 发明人 Saikin Alan H.
Attorney & Agent 代理人 sha yongsheng
More information 更  多  信  息


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