Original document(13 pages)  中文版
    The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.
Application Number
申请号		 200610121530 Application Date
申请日		 2006.08.17
Title 名称 Polishing pad and method of manufacture
Publication Number
公开号		 1915598 Publication Date
公开日		 2007.02.21
Approval Pub. Date Granted Pub. Date
International Classification 分类号 B24D18/00;B24D17/00;B24B29/00;H01L21/304
Applicant(s) Name
申请人		 Rhom And Hass Electronic Mater
Address 地址
Inventor(s) Name 发明人 Saikin Alan H.
Attorney & Agent 代理人 sha yongsheng
More information 更  多  信  息


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