| Original document(34 pages) 中文版 |
A device mounting structure includes: a base; a unit having a mounting area on which a device is mounted; a projection formed on a face of the unit; a first wiring disposed on the unit and between a top part of the projection and the mounting area; a groove provided in the base, the groove incorporating at least part of the projection; and a second wiring disposed at a bottom part of the groove in the base and electrically connected to the first wiring. The first wiring has a resin layer containing metallic particles, and a metal film on the resin layer. |
Application Number
申请号 |
200610114888 |
Application Date
申请日 |
2006.08.16 |
| Title 名称 |
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus |
Publication Number
公开号 |
1915668 |
Publication Date
公开日 |
2007.02.21 |
| Approval Pub. Date |
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Granted Pub. Date |
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| International Classification 分类号 |
B41J2/135;B41J2/045;B41J2/16 |
Applicant(s) Name
申请人 |
Seiko Epson Corp. |
| Address 地址 |
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| Inventor(s) Name 发明人 |
Yoda Tsuyoshi |
| Attorney & Agent 代理人 |
li guiliang |
| More information 更 多 信 息 |
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