| Original document(93 pages) 中文版 |
An adhesive sheet comprising a pressure-sensitive adhesive layer and a substrate layer, wherein the strength of adhesion between the pressure-sensitive adhesive layer and the substrate layer is controlled by means of irradiation with a radiation and the pressure-sensitive adhesive layer comprises the following ingredients: (a) a thermoplastic resin, (b) a heat-polymerizable ingredient, and (c) a compound which generates a base upon irradiation with the radiation. The adhesive sheet satisfies the following inconsistent requirements: it should have tackiness sufficient to keep semiconductor elements held thereon during dicing and, upon subsequent irradiation with a radiation for regulating the strength of adhesion between the pressure-sensitive adhesive layer and the substrate, come to have such low tackiness that it does not damage the elements during pickup. |
Application Number
申请号 |
200610100287 |
Application Date
申请日 |
2002.08.27 |
| Title 名称 |
Adhesive sheet and semiconductor device and process for producing the same |
Publication Number
公开号 |
1916097 |
Publication Date
公开日 |
2007.02.21 |
| Approval Pub. Date |
|
Granted Pub. Date |
|
| International Classification 分类号 |
C09J7/02;H01L21/58 |
Applicant(s) Name
申请人 |
Hitachi Chemical Co., Ltd. |
| Address 地址 |
|
| Inventor(s) Name 发明人 |
Kawakami Hiroyuki;Inada Teiichi;Masuko Takashi;Ookubo Keisuke;Hatakeyama Keiichi;Yanagawa Toshiyuki;Katogi Shigeki |
| Attorney & Agent 代理人 |
luo chundan |
| More information 更 多 信 息 |
|
| Related patents information |
|
|
|
|
|
|