This invention discloses a method for preparing halogen-free and flame-retardant acrylate adhesive for flexible printing circuit board. The adhesive comprises: multiple acrylate monomers, allyl phosphate, crosslinking monomer, initiator, emulsifier, phosphorus-containing filler and inorganic filler. The method comprises: (1) adding multiple acrylate monomers, allyl phosphate, crosslinking monomer, initiator and emulsifier into a reactor; (2) adding deionized water, heaing and polymerizing under stirring to synthesize an emulsion; (3) adding the fillers into the emulsion to obtain the halogen-free and flame-retardant acrylate adhesive. The adhesive can be used for interlayer adhering of multi-layered flexible printing circuit board, and the obtained flexible printing circuit board has such adadvantages as good flame retardancy, high peel strength, good Sn weldability and good synthetic properties. |